What is a microelectronic spot welder?

Microelectronic spot welding machine is an electronic spot welding equipment specially provided for electronic industry and microelectronics industry. It has the function of directly welding enameled wire without removing insulating paint, and realizes lead-free tin welding without adding any flux and solder. This is an advanced environment-friendly Wuxi welding technology at present. When welding, a strong current flows in the tiny welding area, and the electric energy is converted into heat energy. The two metals are firmly welded together at the moment of welding, forming a metal alloy that is not easy to oxidize. It has the advantages of small and firm solder joints, small attenuation to high-frequency signals and high temperature resistance. This equipment is simple to operate, small in size and easy to maintain. Suitable for welding gold wire, silver wire and copper wire. It is especially convenient for small inductance welding of small coils, small magnetic rings and small enameled wires. , can also be used as wiring equipment for circuit board factory.

There are soft gold and hard gold (generally used as golden fingers). The principle is that nickel and gold (commonly known as gold salt) are dissolved in chemical solution, the circuit board is immersed in electroplating bath and current is applied to form a nickel-gold coating on the copper foil surface of the circuit board. Nickel-gold electroplating is widely used in electronic product names because of its high hardness, wear resistance and non-oxidation.

Gold-plated sheet and gold-plated sheet are common processes in circuit board production. With the increasing integration of integrated circuits, the pins of integrated circuits become more and more dense. However, it is difficult to blow the fine pads flat by vertical tin spraying process, which brings difficulties to SMT mounting; In addition, the service life of tinplate is very short. Gold-plated plate just solves these problems. For surface mount technology, especially for 0603 and 0402 subminiature surface mount technology, because the flatness of solder pad is directly related to the quality of solder paste printing process and plays a decisive role in the later reflow soldering quality, the whole board is often plated with gold in high-density subminiature surface mount technology. In the trial-production stage, due to the purchase of components and other factors, the board is often not welded immediately, and it often takes weeks or even months to use. The service life of gold-plated plate is many times longer than that of tin-plated plate. So everyone is willing to adopt. In addition, the cost of gold-plated PCB in the sample stage is almost the same as that of lead-tin alloy board. First, what is gold plating: the whole board is gold plated. Generally refers to gold plating, nickel plating, gold plating and electrolytic gold plating.