On the electronic components package a little "dry goods" please smile!

When we query or purchase electronic components can often be seen in the parameter column of the component has a description of the package, then the components of the package in the end what is it?

First, what is meant by packaging

Encapsulation means that the circuit pins on the silicon chip are connected to an external connector through wires to connect with other devices. The form of packaging refers to the situation used to mount the semiconductor integrated circuit chip. It not only mounts, secures, seals, protects the chip, and improves the electrical and thermal performance, but also connects to the pins of the package through wires on the chip that run through wires on the printed circuit board. It connects to other devices to connect the internal chip to external circuits. Electrical performance is reduced because the chip must be isolated from the outside world to prevent airborne impurities from corroding the chip circuitry. On the other hand, encapsulated chips are also easier to install and transport. This is critical because the quality of the encapsulation technology directly affects the performance of the chip itself, as well as the design and manufacture of the PCB (printed circuit board) to which it is attached.

The ratio of chip area to package area is an important indicator of whether the chip packaging technology is advanced. The closer the ratio, the better. The main considerations for packaging are as follows:

1. The ratio of chip area to package area improves packaging efficiency, as close as possible to 1:1;

2. The pins should be as short as possible to minimize delays and the distance between the pins to ensure non-interference and improve performance;

3. According to the requirements of heat dissipation, the thinner the package, the better.

The package is mainly divided into DIP dual in-line and SMD chip packages. In terms of structure, the package has gone through the earliest transistor TO (e.g. TO-89, TO92) package and developed into a dual in-line package. Subsequently, PHILIP developed a small SOP package, which later gave rise to the SOJ (J-type) Pin Small Outline Package), TSOP (Thin Outline Package), VSOP (Very Small Outline Package), SSOP (Reduced SOP), TSSOP (Thin Reduced SOP) and SOT (Small Outline Transistor), SOIC (Small Outline) Integrated Circuits) and so on. From material media, including metals, ceramics, plastics, and plastics, there are still a lot of metal packages used for circuits that require high-intensity operating conditions, such as military and aerospace.

Packaging has gone through the following development process:

Structural: to -&<GT;Dip-<Trash&GT;plcc-<Trash&GT;qfp-<unk;csp;=""<Trash&GT;=""Li=""Style=""Box casting; -<Unk;csp;=""<Trash&GT;=""Li=""Style="" NIC-Tap-High Color: Active;"&GT;

Material: Metal, Ceramic - <Ceramic, Plastic - <Plastic;

Pin Shape: Long Leads Straight-In - <Short Leads or No Leads Mounted - <Spherical Bumps;

Assembly Methods: Through Hole Insertion - <Surface Mount - <Direct Mounting

II. Specific Package Forms

1. SOP/SOIC Packages

sop is an abbreviation for small outline package in English. Since 1968 to 1969, Philips successfully developed sap packaging technology. Later, soj (jpin small shape package), tsop (thin small shape package), vsop (very small shape package), ssop (small size package), and gradually derived thin size transistors and small shape transistors. soic (small shape integrated circuits) and so on.

2, DIP package

DIP is an abbreviation for Double In-Line Package (Double In-Line Package). In the plug-in package, the pins are pulled out from both sides of the package, and there are two kinds of packaging materials: plastic and ceramic.


DIP is the most popular plug-in package, and its applications include standard logic ICs, memory LSIs, and microcomputer circuits.

3, PLCC package

PLCC is a plastic lead chip carrier, that is, plastic J lead chip package abbreviation.PLCC package form for the square, 32 pin package, all around the pin. The form factor is much smaller than the DIP package.PLCC package is suitable for SMT surface mounting technology on the PCB installation and wiring. It has the advantages of small form factor and high reliability.

4, TQFP package

TQFP is an acronym for Thin Quadrilateral Flat Packages in English, which is a thin plastic quadrangular flat package. The TQFP process effectively utilizes space and reduces the need for printed circuit board space. Because of the reduced height and size, this packaging process is well suited for space-critical applications such as PCMCIA cards and networking equipment. Almost all ALTERA CPLD / FPGAs are available in TQFP packages.

5, PQFP package

PQFP is the English acronym for Plastic Quadratic Flat Packaging, that is, Plastic Packaging Quadratic Flat Packaging. PQFP package chips have a small distance between the pins, the pins are very thin, and are generally used in the form of large or very large integrated circuits in this package, and the number of pins is generally in the more than 100.

6, TSOP package

tsop is the British abbreviation for thin small outline package, it is a thin, small-sized package. tsop memory packaging technology is a typical feature of the manufacturing of pins around the packaged chip. tsop is suitable for the use of smt technology (surface mounting technology) in the pcbs (printed circuit boards) mounted wiring. When the tsop package is large, parasitic parameters (large current variations causing output voltage perturbations) are reduced, making it suitable for high-frequency applications, relatively easy to operate, and relatively reliable.

7, BGA package

BGA is Ball Grid Array Package (Ball Grid Array Package) abbreviation, that is, Ball Grid Array Package. 1920s and 1990s, with the advancement of technology, the chip integration continues to improve, the number of I - ≤ O pins increased dramatically, and power consumption has increased, the requirements of the integrated circuit package also The requirements for IC packaging are also getting higher and higher. In order to adapt to the needs of development, BGA package began to be used in production.

Memory packaged in BGA technology can increase memory capacity by 2 to 3 times without changing memory size. Compared to TSOP, BGA is smaller. Better heat dissipation and electrical performance. BGA packaging technology enables a significant increase in storage capacity per square inch, with BGA packaging technology being only 1/3 the size of a TSOP package for the same capacity of memory products; in addition, BGA packaging has a faster and more efficient way of dissipating heat compared to traditional TSOP packaging.

? The I/O terminals of a BGA package are distributed as an array of circular or columnar solder joints underneath the package. The advantage of BGA technology is that despite the increase in the number of I/O pins, the pitch of the pins does not decrease but increases. Increase assembly yield; Although its power consumption increases, BGA can be soldered using a controlled collapse chip method to improve its electro-thermal properties; Thickness and weight are reduced compared to previous packaging technologies; Parasitic parameters are reduced, signaling delays are small, and the frequency of use is greatly increased; The assembly can be used for high reliability ****-side soldering.

Speaking of BGA packages, we must mention Kingmax's patented Micro BGA technology. Micro BGA, known as Micro Ball Grid Array in English, belongs to a branch of BGA packaging technology. developed in August 1998 by Kingmax. The ratio of chip area to package area is not less than 1:1.14, which can increase the storage capacity by 2-3 times in the same volume. Compared with TSOP packaging products, it is characterized by small size, good heat dissipation and good electrical performance.

Memory products using tin-based fabric plus packaging technology are only 1/3 the size of tsop packages. tsop packaged memory pins come from around the chip, while tin comes from the center direction of the chip. This method effectively reduces the signal transmission distance. The length of the signal transmission line is only 1/4 the length of conventional tsop technology, so signal attenuation is also reduced. This not only greatly improves the chip's anti-interference and anti-noise performance, but also improves the circuit performance. tinybga wrapped chips can resist up to 300 MHz of external frequency, while traditional tsop wrapping technology can only resist 150 MHz of external frequency.

TiNYBGA packaged memories are also thinner (package height is less than 0.8 mm), with an effective heat sink path from the metal substrate to the heat sink of only 0.36 mm. As a result, TinyBGA memories have a high thermal conductivity, making them ideally suited for long-running systems, and are highly stable.

The products are advertised as "AD", "ADV", and "OP" or "Ref. "AD", "ADV", "OP" or "Ref", "AMP", "SMP", "SSM", "TMP", "TMP", "TMP", "TMP", "TMP", "TMP", "TMP", "TMP" and so on. ", "TMS" and so on.

Explanation of suffix:

1. In the suffix, J means civil product (0-70°C), N means ordinary plastic seal, and R in the suffix means surface sticker.

2. Ceramic seal with D or Q suffix, industrial grade (45-85 C). Suffix h denotes round cap.

3. Suffix sd or 883 for military.

For example: jn dip encapsulated jr table labeled jd dip ceramic seal.