What is the work of semiconductor bp process?

The work of this process refers to one of the following semiconductor processes.

BP is the abbreviation of Back-EndProcess, also known as packaging process. It is the process of packaging the chip into the final semiconductor device, including chip cutting, wire bonding, packaging, testing and other steps.

Chip cutting: cutting chips on the wafer into individual chips; Lead welding: connect the chip with the lead to form a circuit; Packaging: the chip and lead are packaged in a plastic or metal shell to protect the chip and lead; Testing: Test the packaged chip to ensure that it meets the specification requirements.