Advantages of 3D Packaging for 3D Packaging Technology

In terms of size and weight, 3D design replaces single-chip packaging to reduce device size and weight. Compared with traditional packaging, the use of 3D technology can shorten the size and weight reduction of up to 40-50 times; in terms of speed, 3D technology saves power to enable 3D components to run at a faster conversion speed per second without increasing energy consumption, parasitics and methods; silicon post-processing and so on.

3D packaging improves many properties of the chip, such as size, weight, speed, yield and energy consumption. Currently, 3D package development has limitations in terms of quality, electrical characteristics, mechanical properties, thermal characteristics, package cost, production time, etc., and in many cases, these factors are interrelated.How and when will 3D package development be completed? Most IC experts believe it may go through the following stages. Flash memory wafer stacks with TSVs and conductive pastes will likely evolve, followed by the emergence of IC surface-to-surface bonding with surface bump spacing as small as 5 μm. Finally, systems-on-silicon will evolve to the point where memory, graphics, and other ICs will be bonded to microprocessor chips.