Traditional Culture Encyclopedia - Traditional culture - Which process in the semiconductor packaging process to use grinding wheel
Which process in the semiconductor packaging process to use grinding wheel
dicing,
grid
cutting, to cut the die on the wafer, in order to encapsulate
wafer
edge
rounder, wafer
edge chamfering and polishing, the special grinding disk
CMP, chemical machinery. Grinding, not technically a wheel, but actually a diamond pad+slurry, dissolving and grinding at the same time
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