Overview of integrated circuit packaging

The position of the integrated circuit package in the electronic pyramid is both the apex and the bottom of the pyramid. It is well-founded to say that it is in both positions at the same time. From the density of electronic components (such as transistors), ic represents the tip of electronics. But IC is also a starting point, a basic structural unit and the foundation of most electronic systems in our lives. Similarly, ic is not only a single chip or a basic electronic structure, but also many different types of IC (analog circuits, digital circuits, RF circuits, sensors, etc. ), so the requirements and requirements for packaging are different. In this paper, the packaging technology of integrated circuits is comprehensively reviewed, and various materials and processes used to manufacture these indispensable packaging structures are introduced with thick lines.

Integrated circuit packaging must also fully adapt to the needs and development of electronic machines. Because of the different functions of various electronic equipment and instruments, their overall structure and assembly requirements are often different. Therefore, integrated circuit packaging must be diversified to meet the needs of various machines.

Integrated circuit packaging has progressed with the development of integrated circuits. With the continuous development of aerospace, aviation, machinery, light industry, chemical industry and other industries, the whole machine is also developing towards multi-function and miniaturization. In this way, the requirements for the integration of integrated circuits are getting higher and higher, and the functions are becoming more and more complicated. Accordingly, it is required that the packaging density of integrated circuits is increasing, the number of leads is increasing, the volume is getting smaller and smaller, the weight is getting lighter and lighter, and the upgrading is getting faster and faster. The rationality and scientificity of packaging structure will directly affect the quality of integrated circuits. Therefore, for manufacturers and users of integrated circuits, in addition to mastering the performance parameters of various integrated circuits and identifying the lead arrangement, they should also have a systematic understanding and understanding of the overall dimensions, tolerances, structural characteristics and packaging materials of various integrated circuits. So that the integrated circuit manufacturer will not reduce the performance of the integrated circuit due to improper package selection; It also enables users of integrated circuits to make reasonable plane layout and space occupation when using integrated circuits for design and assembly, so as to achieve proper selection and reasonable application.