How to package semiconductors? Semiconductor packaging method

1. Batch packaging refers to the process of processing the tested wafer into independent chips according to the product model and functional requirements. The packaging process is as follows: the wafer from the previous wafer process is cut into small die by dicing process, and then the cut die is attached to the island of the corresponding substrate (lead frame) frame with glue.

2. Connect the bonding pad of the wafer to the corresponding lead of the substrate with ultra-fine metal (Suk Kim copper aluminum) wire or conductive resin to form the required circuit; Then, the individual wafers are encapsulated and protected with a plastic case. After plastic packaging, a series of operations are carried out. Packaged finished products should be inspected, usually through incoming inspection, testing, packaging and other procedures, and finally put into storage for shipment.