Various package forms

Package is broadly divided into two categories: DIP inline and SMD chip form. Specifically:

1, PFPF (plastic flat package)

Plastic flat package. Plastic QFP alias (see QFP).

2, MSP (mini square package)

QFI alias (see QFI), in the early stages of development, mostly called MSP. QFI is the name specified by the Japan Electrical and Mechanical Industries Association.

3. LQFP (low profile quad flat package)

Thin QFP refers to a QFP with a package body thickness of 1.4mm, and is the name used by the Japan Electronic Manufacturers' Association (JEMA) in accordance with the new QFP profile specifications.

4, piggy back

Package. It refers to a ceramic package with a socket, similar to DIP, QFP, and QFN. It is used for evaluating the program confirmation operation when developing equipment with microcomputer.

5, QTCP (quad tape carrier package)

Quad side pin carrier package. one of the TCP packages, the pins are formed on the insulating tape and lead out from the four sides of the package. It is a thin package utilizing TAB technology (see TAB. TCP).

Expanded Information:

Examples of Package Types:

The following are examples of packages. p>Example analysis of the type of package:

Components are packaged with international standards, different components are packaged in different forms, even the same device can have more than one package, for example:

1, SMD transistor: SOT23-2

Transistors have three legs, emitter -base-collector, its package is the three legs on the PCB board 1:1 projection, that is, the chip triode flat on the PCB, the pads and the three legs of the triode exactly coincide.

2. Chip resistor package: 0805

The chip resistor has a variety of package specifications, such as 1210, 0805, 0603, 0402 and so on.

3, microcontroller package: LQFP48

I believe that the STC89C51 microcontroller we have seen, the DIP-40 package are also aware of, the following look at the LQFP-48 package, this form of packaging has four sides, each side is 12 pins, a **** is 48.

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