Triode packaging technology

At present, the packaging of triodes is in the traditional way, for example, the chip is packaged into a transistor (full name: Wire bond, abbreviated as WB) with certain functions by printing money.

However, for some miniaturized electronic products with integrated triodes, the triodes packaged by the traditional wire bonding method occupy a large space and have low packaging efficiency.

Technical realization elements:

The embodiment of the invention provides a triode packaging method and a triode, which are used for solving the problems of large occupied space and low packaging efficiency of the existing triode.

The first aspect of the invention provides a triode packaging method, which comprises the following steps:

Providing a carrier and covering at least one surface of the carrier with a surface metal layer;

Covering a resist film on the circuit pattern area of the surface metal layer;

Electroplating the circuit pattern-free region of the surface metal layer to form at least one first pad;

Soldering a chip on the at least one first pad;

Welding at least two second pads on the chip to form a triode template;

The triode template is plastic-sealed by using composite materials;

Drilling a blind hole in the vertical direction of the second pad and at least one first pad, and processing the blind hole into a metallized blind hole;

The metallized blind hole is patterned to form a closed circuit, and the triode is encapsulated.

In some possible embodiments, covering the resist film on the circuit pattern area of the surface metal layer includes:

Coating an anticorrosive film on the surface metal layer;

After the exposure and development steps, the resist film in the non-circuit pattern area is removed, so that the remaining resist film covers the circuit pattern area.

In some possible embodiments, before the chip is soldered on at least one first pad, the packaging method further comprises:

Removing the resist film in the circuit pattern area.

In some possible embodiments, soldering the chip on at least one first pad comprises:

Placing a chip on the at least one first pad, and soldering the chip on the at least one first pad by at least one of solder paste, tin plating, metal bonding and conductive adhesive bonding.

In some possible embodiments, soldering the second pad on the chip to form the triode template includes:

Electroplating the target area of the chip to form a second pad.

In some possible embodiments, drilling blind holes in the vertical direction of the second pad and the at least one first pad includes:

A laser blind hole is used to drill a blind hole in the vertical direction of the second pad and at least one first pad.

Processing blind holes into metallized blind holes includes:

At least one of chemical copper deposition, copper electroplating, copper sputtering and conductive copper glue is used to process the blind holes into metallized blind holes.

In some possible embodiments, after patterning the metallized blind hole to form a closed circuit, the packaging method further comprises:

Put the composite material into the mold, carry out plastic sealing treatment, and remove the excess composite material.

In some possible embodiments, the packaging method further comprises:

Soldering a target electronic component on at least one first pad, wherein the target electronic component includes at least one of a resistor and a capacitor.

A second aspect of the present invention provides a triode, which is packaged by any one of the first aspect or the first aspect.

As can be seen from the above technical scheme, the embodiment of the invention has the following advantages:

Different from the prior art, the invention adopts the traditional wire bonding method to package the triode, and the chip and the pad are welded together through welding or blind hole connection, so that the chip is packaged into a triode with a certain function, and the packaged triode occupies a small space, and the whole process flow is simple, thus effectively improving the packaging efficiency of the triode.