What does the integrated circuit package test mean?

Testing before and after chip packaging. The semiconductor production process includes wafer manufacturing, wafer testing, chip packaging and post-packaging testing. Semiconductor packaging test refers to the process of processing the wafer to be tested into independent chips according to the product model and functional requirements. The packaging process is as follows: the wafer from the wafer precursor process is cut into small wafers after the dicing process, and then the cut wafers are glued to the islands of the corresponding substrate (lead frame), and then the pads of the wafers are connected to the corresponding pins of the substrate with ultra-fine metal (gold, tin, copper, aluminum) wires or conductive resin to form the required circuits; Then, the individual wafers are protected with plastic boxes. After plastic packaging, there are a series of operations such as post-curing, cutting and molding, electroplating and printing. After packaging is completed, the finished product is tested, usually through inspection, testing, packaging and other processes, and finally put into storage for delivery. Typical packaging processes include dicing, packaging, bonding, plastic packaging, trimming, electroplating, printing, cutting, molding, appearance inspection, finished product inspection, packaging and shipment.