What are the applications of laser engraving machine?

At present, laser has been widely used in laser welding, laser cutting, laser drilling, laser quenching, laser heat treatment, laser marking, glass carving, laser trimming, laser lithography, laser film making, laser film processing, laser packaging, laser circuit repair, laser wiring technology, laser cleaning and other laser processes:

Laser cutting process:

When it is applied to the processing of metal and nonmetal materials, it can greatly shorten the processing time, reduce the processing cost and improve the quality of the workpiece. Pulsed laser is suitable for metallic materials and continuous laser is suitable for nonmetallic materials, which is an important application field of laser cutting technology. Modern laser has become a "sword" that people fantasize about "cutting iron like mud". The application of laser in industrial field has limitations and shortcomings. For example, cutting food and plywood by laser is not successful, food is burned while being cut, and cutting plywood is far from economical.

Laser welding process:

It has the function of purifying molten pool, can purify weld metal, and is suitable for welding between the same and different metal materials. Laser welding has high energy density, which is especially beneficial to the welding of metals with high melting point, high reflectivity, high thermal conductivity and great differences in physical properties. Laser welding, using a laser beam with less power than cutting metal, melts the material without vaporizing it, and becomes a continuous solid structure after cooling.

Laser drilling process:

Laser drilling technology has the advantages of high precision, strong versatility, high efficiency, low cost and remarkable comprehensive technical and economic benefits, and has become one of the key technologies in the field of modern manufacturing. Before laser appeared, only hard materials could be used to punch holes in hard materials. In this way, it is extremely difficult to drill holes in the hardest diamonds. After the laser appeared, this operation was fast and safe. But the hole drilled by laser is conical, not cylindrical by mechanical drilling, which is inconvenient in some places.

Laser marking process:

Laser marking is one of the biggest application fields of laser processing. Laser marking is a marking method that uses high energy density laser to irradiate the workpiece locally, so that the surface material is vaporized or discolored, thus leaving a permanent mark. Laser marking can print all kinds of characters, symbols and patterns, and the size of characters can range from millimeters to microns, which is of special significance to the anti-counterfeiting of products. Excimer laser marking is a new technology developed in recent years, which is especially suitable for metal marking and can realize submicron marking. It has been widely used in microelectronics industry and bioengineering.

Laser counterweight balancing process;

Laser is used to remove the unbalanced and overweight parts on the high-speed rotating parts, so that the inertial axis and the rotating axis overlap and achieve the process of dynamic balance. Laser de-weighting balance technology has two functions of measuring and de-weighting, which can measure and correct imbalance at the same time, greatly improving efficiency, and has broad application prospects in the field of gyro manufacturing. For high-precision rotors, laser dynamic balance can improve the balance accuracy by times, and the balance accuracy of its mass eccentricity value can reach 1% or a few thousandths of a micron.

Laser etching process:

Compared with the traditional chemical etching process, it is simpler, can greatly reduce the production cost, and can process lines with a width of 0. 125 ~ 1 micron, which is very suitable for VLSI manufacturing.

Laser resistance adjustment process:

Laser trimming technology can automatically and accurately trim the specified resistance, and the accuracy can reach 0.0 1% ~ 0.002%, which is higher in accuracy, higher in efficiency and lower in cost than traditional machining methods. Laser trimming includes trimming of thin film resistance (0.0 1 ~ 0.6 micron thick) and thick film resistance (20 ~ 50 micron thick), trimming of capacitor and trimming of hybrid integrated circuit.

Laser storage technology:

Laser storage technology is a technology to record video, audio, text and computer information by laser, and it is one of the supporting technologies in the information age.

Laser scribing process:

Laser dicing technology is the key technology in the production of integrated circuits, with fine dicing, high precision (line width 15 ~ 25 microns, groove depth 5 ~ 200 microns), fast processing speed (up to 200 mm/s) and yield of more than 99.5%. Laser cleaning process:

Using laser cleaning technology can greatly reduce the particle pollution of processing devices and improve the yield of precision devices.

Laser heat treatment and surface treatment processes include: laser phase transformation hardening, laser cladding, laser surface alloying, laser annealing, laser shock hardening, laser enhanced electroplating and laser glazing. These technologies have played an important role in changing the mechanical properties, heat resistance and corrosion resistance of materials.

Laser is also widely used in electronic industry. It can be used for precision machining micro-instruments, precision cutting fragile semiconductor materials and adjusting the resistance of micro-resistors. With the improvement of laser performance and the appearance of new lasers, the application of laser in VLSI has become a key technology that many other processes cannot replace, which shows an encouraging prospect for the development of VLSI.

Laser technology is the product of high technology, which promotes the in-depth development of scientific research and opens up many new disciplines, such as nonlinear optics, laser spectroscopy, laser chemistry, laser biology and so on. Laser is used to study photosynthesis, hemoglobin, DNA and other mechanisms closely related to life. Laser will also become the new standard of time and length. In the future, any high-precision clock can be calibrated by a laser beam with a certain wavelength.

Laser will also play an important role in the application of nuclear energy. Optimistic experts estimate that by 2020, powerful lasers will produce safe and economical thermonuclear fusion, which is similar to the nuclear reaction process inside stars. If it is realized, thermonuclear fusion will bring huge social and economic benefits, and the energy crisis will no longer exist. By then, a bucket of water and hydrogen fusion will generate enough electricity for a city.