What is wafer testing in IC testing?

First of all, we need to understand the process of IC manufacturing, all IC is the first from the wafer to start processing, when the wafer after the completion of the manufacturing process, generally need to be tested, and then can be encapsulated, otherwise it may be the whole piece of the wafer are unqualified performance parameters, if the direct encapsulation will cause losses.

The test for the garden piece of the test is to use the probe for testing, the use of special materials (such as rhenium tungsten) made of the probe has a certain toughness, cut the conductivity is good, can be directly tied to the pad of the wafer, and then the test equipment through the probe on the chip to impose an electrical signal, which can be carried out on the performance parameters of the test, in order to discern the wafer on the chip on the good or bad. Because called Wafer Test (WT), or CP.