The process flow of the circuit board is explained in detail.

1. Cutting: cut large sheet into small PNL to facilitate process operation.

2. Inner layer: the circuit for manufacturing the innermost core board of the multilayer board.

3. Pressing: the inner substrate is made of PP/ copper foil laminated and pressed at high temperature and high pressure.

4. Drilling: it is convenient for plugging and unplugging, so that the inner and outer layers of the following process are conductive.

5. Electroplating: it is the conduction between the inner layer and the outer layer.

6. Outer layer: make the outermost circuit.

7. Welding protection: Apply a protective film to prevent oxidation and scratches.

8. Machining: protect the copper leakage position on the surface. If it is molded, it should be aimed at the size required by customers for large PNL.

9. Test: Use electricity to measure whether the inside of the circuit board is conductive.

10. Final inspection: visual inspection of the circuit board.

In addition, the development speed and temperature you mentioned need to be based on the comprehensive factors of each product and your company's equipment.