What polishing solution can be used to grind silicon carbide?

When grinding silicon carbide, because of the high hardness of SiC, it is usually necessary to use abrasive with high hardness, such as boron carbide. At present, for the processing of silicon carbide wafers, diamond grinding liquid with higher Mohs hardness and faster speed is generally used to grind to a certain thickness, and then traditional CMP polishing liquid is used for fine polishing to achieve the required surface state.

Especially, the silicon carbide polishing solution (CM-S600 series) is mainly composed of high-purity silica gel, which not only has good stability and dispersibility, but also has high removal rate, excellent surface effect and no damage to the workpiece. In addition, the diamond polishing solution independently developed by Qual Diamond also provides efficient polishing solution for advanced materials such as silicon carbide.

In a word, it is very important to select the appropriate polishing solution and process for grinding and polishing silicon carbide, and the appropriate polishing solution can be selected according to the specific needs and material characteristics.