What does the chip package test do?

Chip packaging test refers to the process of processing the wafer that has passed the test according to the product model and its functional requirements, and then obtaining an independent chip.

Integratedcircuit is a way of circuit miniaturization (mainly including semiconductor devices and passive components). By adopting a certain process, the components and wiring needed in the circuit are connected with each other, made on a small piece or several pieces of semiconductor wafers or dielectric substrates, and then packaged in a package to form a microstructure with the required circuit functions. All the components are integrated in structure, which makes electronic components take a big step towards miniaturization, low power consumption, intelligence and high reliability.

It is a microelectronic device or element, which is represented by the letter "ic" in the circuit. Inventors are jack kilby (integrated circuit based on germanium (Ge)) and robert noyce (integrated circuit based on silicon (Si)). Today, most of the applications in the semiconductor industry are silicon-based integrated circuits, which are a new type of semiconductor devices developed from the late 1950s to the 1960s.