What are the common chip packages? What are the characteristics of each?

We often hear that so-and-so chip using so-and-so package, in our computers, there are a variety of different processing chip, then, they are what kind of package form? And what kind of technical characteristics and superiority of these packaging forms? Then please take a look at the following article, will introduce you to the characteristics and advantages of individual chip packaging form.

One, DIP dual in-line package

DIP (DualIn-line Package) refers to the use of dual in-line package form of integrated circuits, the vast majority of small-scale integrated circuits (IC) are used in this form of packaging, the number of pins is generally no more than 100. The CPU chip in DIP package has two rows of pins, which need to be inserted into the chip socket with DIP structure. Of course, it can also be directly inserted in the same number of holes and geometric arrangement of the circuit board for welding.DIP package chip from the chip socket should be inserted and removed with special care, so as to avoid damage to the pins.

DIP package has the following characteristics:

1. Suitable for PCB (Printed Circuit Board) on the through-hole welding, easy to operate.

2. The ratio between chip area and package area is larger, so the volume is also larger.

Intel series CPU 8088 is used in this package form, cache (Cache) and early memory chips are also in this package form.

Two, QFP plastic square flat package and PFP plastic flat component package

QFP (Plastic Quad Flat Package) package chip pin-to-pin distance is very small, the pin is very thin, generally large-scale or very large integrated circuits are used in this form of packaging, the number of pins is generally more than 100. With this form of packaging chip must be used SMD (surface mount device technology) will be the chip and the motherboard welding up. SMD mounted chips do not have to punch holes in the motherboard, generally on the surface of the motherboard with a well-designed corresponding pins of the soldering points. Chip pins aligned with the corresponding soldering points, can be realized with the motherboard welding. With this method of welding on the chip, if you do not use a special tool is very difficult to dismantle down.

PFP (Plastic Flat Package) way to package the chip and QFP way is basically the same. The only difference is that QFP is generally square, while PFP can be both square and rectangular.

QFP/PFP package has the following characteristics:

1. Suitable for SMD surface mount technology in the PCB circuit board mounting wiring.

2. Suitable for high frequency use.

3. Easy to operate, high reliability.

4. Smaller ratio between chip area and package area.

Intel series CPU 80286, 80386 and some 486 motherboards use this package form.

Three, PGA Pin Grid Array Package

PGA (Pin Grid Array Package) chip package form in the chip inside and outside of a number of square-shaped pins, each square-shaped pins along the perimeter of the chip spaced a certain distance apart. According to the number of pins, can be surrounded by 2-5 circles. For installation, the chip is inserted into a specialized PGA socket. In order to make the CPU easier to install and remove, starting with the 486 chip, there is a CPU socket called ZIF, which is specifically designed to meet the requirements of the PGA-packaged CPU in terms of installation and removal.

ZIF (Zero Insertion Force Socket) is a zero insertion force socket. By gently lifting the wrench on this type of socket, the CPU can be easily and effortlessly inserted into the socket. Then the wrench is pressed back to the original position, using the special structure of the socket itself to generate the squeeze force, the CPU pins and the socket firmly in contact, there is absolutely no problem of poor contact. To remove the CPU chip, simply lift the socket wrench gently, then the pressure is lifted and the CPU chip can be easily removed.

The PGA package has the following features:

1. Easier plug-and-play operation and higher reliability.

2. Adaptable to higher frequencies.

Intel series CPU, 80486 and Pentium, Pentium Pro are used in this package form.

Four, BGA ball grid array package

With the development of integrated circuit technology, the packaging requirements for integrated circuits more stringent. This is because the packaging technology is related to the functionality of the product, when the frequency of the IC is more than 100MHz, the traditional packaging may produce the so-called "CrossTalk" phenomenon, and when the number of pins of the IC is greater than 208 Pin, the traditional packaging has its own degree of difficulty. Therefore, in addition to the use of QFP packaging, most of today's high-pin-count chips (such as graphics chips and chipsets, etc.) have turned to BGA (Ball Grid Array Package) packaging technology, which has become the best choice for high-density, high-performance, multi-pin packages for CPUs, motherboards, and other south/north bridge chips.

BGA packaging technology can be divided into five categories:

1. PBGA (Plasric BGA) substrate: generally 2-4 layers of organic material composed of multilayer boards. Intel series of CPUs, Pentium II, III, IV processors are used in this package form.

2. CBGA (CeramicBGA) substrate: that is, ceramic substrate, the chip and the substrate electrical connection is usually used between the FlipChip (FlipChip, FC for short) mounting. Intel series CPU, Pentium I, II, Pentium Pro processors have been used in this package form.

3. FCBGA (FilpChipBGA) substrate: rigid multilayer substrate.

4. TBGA (TapeBGA) substrate: the substrate is a strip of soft 1-2 layer PCB circuit board.

5. CDPBGA (Carity Down PBGA) substrate: refers to the center of the package has a square-shaped low depression of the chip area (also known as the cavity area).

BGA package has the following characteristics:

1. Although the number of I/O pins increased, but the distance between the pins is much larger than the QFP package, improving the yield.

2. Although the power consumption of the BGA increased, but because of the use of controlled collapse chip method of welding, which can improve the electrical and thermal performance.

3. Signal transmission delay is small, the adaptive frequency is greatly improved.

4. Assembly can be used *** surface welding, reliability is greatly improved.

BGA package has entered the practical stage after more than a decade of development. 1987, Japan's Citizen (Citizen) began to work on the development of plastic spherical grid array packaged chip (i.e., BGA). Later, Motorola, Compaq and other companies also joined the ranks of the development of BGA. 1993, Motorola took the lead in BGA applied to cell phones. In 1993, Motorola was the first to apply BGA to mobile phones. In the same year, Compaq also applied it to workstations and PC computers. Until five or six years ago, Intel Corporation in the computer CPU (i.e., Pentium II, Pentium III, Pentium IV, etc.), as well as chipsets (such as the i850) in the beginning of the use of BGA, which played a role in the expansion of BGA applications. Currently, BGA has become an extremely popular IC packaging technology, its global market size in 2000 for 1.2 billion pieces, is expected to market demand in 2005 than in 2000, there is more than 70% growth.

Fifth, CSP chip size package

With the global demand for personalized electronic products, lightweight trend, packaging technology has advanced to CSP (Chip Size Package). It reduces the size of the chip package form factor to achieve how big the bare chip size is, and how big the package size is. That is, after the package IC size edge length is not greater than 1.2 times the chip, IC area is only larger than the grain (Die) is not more than 1.4 times.

CSP package can be divided into four categories:

1. Lead Frame Type (traditional wire frame form), on behalf of Fujitsu, Hitachi, Rohm, Goldstar (Goldstar) and so on.

2. Rigid Interposer Type (Rigid Interposer Type), represented by Motorola, Sony, Toshiba, Panasonic and so on.

3. Flexible Interposer Type (Flexible Interposer Type), the most famous of which is Tessera's microBGA, CTS sim-BGA also uses the same principle. Other representative manufacturers include General Electric (GE) and NEC.

4. Wafer Level Package (wafer size package): different from the traditional single chip package, WLCSP is the whole wafer cut into a single chip, it is claimed to be the future mainstream of packaging technology, has been put into R & D manufacturers including FCT, Aptos, Casio, EPIC, Fujitsu, Mitsubishi Electronics and others.

CSP package has the following characteristics:

1. To meet the needs of the chip I/O pins are increasing.

2. The ratio between chip area and package area is very small.

3. Greatly reduces latency time.

CSP packages are suitable for ICs with fewer feet, such as memory sticks and portable electronics. In the future, it will be used in a large number of information appliances (IA), digital television (DTV), electronic books (E-Book), wireless networks WLAN / GigabitEthemet, ADSL / cell phone chips, Bluetooth (Bluetooth) and other emerging products.

Six, MCM multi-chip module

In order to solve the problem of low integration of a single chip and function is not perfect enough, the multiple high integration, high performance, high reliability of the chip, in the high-density multi-layer interconnect substrate with SMD technology to form a variety of electronic module system, thus appearing in the MCM (Multi Chip Model) Multi-Chip Module system.

MCM has the following characteristics:

1. Package delay time is reduced, easy to realize the module high-speed.

2. Reduced package size and weight of the whole machine/module.

3. System reliability is greatly improved.

Conclusion

In short, due to the continuous development of the CPU and other ultra-large integrated circuits, integrated circuits in the form of packaging also continue to make corresponding adjustments to the changes, and the progress of the packaging form will, in turn, promote the chip technology forward.