Semiconductor molding collapse causes

1. Mold design is unreasonable: mold there is an unreasonable structural design or gate settings, resulting in the sealing material in the filling process can not be a smooth flow, resulting in the collapse of the line.

2. Improper selection of sealing material: the use of sealing material does not meet the requirements, can not adapt to the special properties of semiconductor products, such as thermal expansion coefficient mismatch, resulting in shrinkage of the sealing material in the cooling process collapse.

3. Injection speed is too fast: injection speed is too fast, resulting in uneven filling of the sealing material in the mold, resulting in air wrapping or localized accumulation, which leads to the collapse of the sealing material after curing.

4. Improper mold temperature control: mold temperature is too high, resulting in premature curing of the sealing material, too low, resulting in poor fluidity of the sealing material, can not fill the mold, may produce collapse line.

5. Poor exhaust: there is poor exhaust in the mold, resulting in the mold air can not be discharged in a timely manner, thus forming air bubbles in the plastic sealing material and produce collapse line.