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Color separation principle of machine vision
The characteristic of machine vision system is that it can improve the flexibility and automation of production. Machine vision is often used to replace artificial vision in some dangerous working environments that are not suitable for manual operation or occasions where artificial vision is difficult to meet the requirements.
In addition, in the process of large-scale industrial production, machine vision system is obviously faster and more accurate than manual method in detecting product quality, which can greatly improve production efficiency and production automation. In addition, machine vision system is convenient for information integration and is the basic technology to realize modern industrial automation.
Three Functions of Machine Vision System Application
1. Visual inspection: Check whether there are any quality problems in the products on the production line, which is also the link that takes the most place of labor. For example, semiconductor wafer inspection in electronics industry, surface scratch inspection in manufacturing industry, panel printing quality inspection in automobile industry, color difference inspection in printing industry, medicine bottle packaging defect inspection in medical industry, appearance packaging inspection in food industry, etc.
2. Visual recognition: recognition uses machine vision positioning to process, analyze and understand images to identify targets and objects in different modes. It can track and collect data and is widely used in automobile parts, food, medicine and other fields. For example, material distribution, sorting, bar code scanning in industrial production process and express sorting in logistics industry.
3. Visual positioning: Positioning Visual positioning requires that the machine vision system can quickly and accurately find the tested part and confirm its position, and use machine vision to position the loading and unloading, and guide the mechanical arm to grab it accurately. For example, in the field of semiconductor packaging, equipment needs to adjust the pickup head according to the chip position information obtained by machine vision, accurately pick up the chip and bind it.
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