STMicroelectronics Details

The STMicroelectronics (ST) Group was founded in 1987 as a result of the merger of SGS Microelectronics of Italy and Thomson Semiconductor of France, and in May 1998, SGS-Thomson Microelectronics changed its name to STMicroelectronics Ltd. STMicroelectronics is one of the world's largest semiconductor companies, with annual revenues of $9.85 billion in 2006 and company revenues of $4.69 billion in the first six months of 2007.

Basic introduction Company name: STMicroelectronics Group Foreign name: STMicroelectronics Headquarter location: Switzerland Founded: June 1988 Scope of business: semiconductors, etc. Abbreviations: ST Company profile, product portfolio, R&D and manufacturing, multinational alliances, principles of excellence, basic information, product range, specialized products, systems-on-chip, customized wafers, standard products, microcontrollers, microcontrollers, customized wafers, standard products. , Microcontrollers, Security ICs, Memory, Discrete Devices, Standard Products, Memory, Intelligent Power Supplies, Standard Devices, Discrete Devices, RF, Real-Time Clock, ST Alliance, ST University, University Profiles, Programs, China Union, Company Overview ST's sales revenues are evenly distributed among the semiconductor industry's seventh fastest-growing market (percentage of 2007 sales revenues accounted for by the five largest markets): Communications (35%), Consumer (17%), Computer (16%), Automotive (16%) and Industrial (16%). According to the latest industry statistics, STMicroelectronics is the world's fifth largest semiconductor manufacturer and a world leader in many markets. For example, STMicroelectronics is the world's No. 1 manufacturer of dedicated analog chips and power conversion chips, the world's No. 1 supplier of industrial semiconductors and set-top box chips, and a world leader in the fields of discrete devices, cell phone camera modules, and automotive integrated circuits. Product portfolio Aiming to be the market leader in multimedia suite integration and power solutions, ST has one of the world's strongest product portfolios, ranging from specialized products with a high intellectual property content to innovative products in multiple fields, such as discrete devices, high-performance microcontrollers, secure smartcard ICs, and microelectromechanical systems (MEMS) devices. ST is a pioneer in the development of complex ICs utilizing a platform-based design approach in demanding suites such as mobile multimedia, set-top boxes and computer peripherals, and continues to improve on this design approach. ST has a well-balanced product portfolio to meet the needs of all microelectronics users. ST is the preferred partner for System-on-Chip (SoC) projects for strategic customers worldwide, and the company also supports local companies throughout the entire process to meet their needs for general-purpose devices and solutions. ST has announced a joint venture with Intel and Francisco Partners to create an independent semiconductor company called Numonyx, which will focus on providing non-volatile memory solutions for consumer electronics and industrial equipment. R&D & Manufacturing Since its founding, ST has never wavered in its investment in R&D and is recognized as one of the most innovative companies in the semiconductor industry. Manufacturing processes include advanced CMOS logic (including embedded memory derivatives), mixed-signal, analog and power manufacturing processes. In the advanced CMOS area, ST will work with the IBM alliance to develop next-generation manufacturing processes, including 32nm and 22nm CMOS process development, design realization techniques and advanced research for 300mm wafer fabrication, in addition to utilizing ST and IBM's 300mm production facility in Crolles, France, to develop high-value-added CMOS-derived System-on-Chip technology. STMicroelectronics has a vast global network of front- and back-end wafer manufacturing (front-end refers to wafer fabrication, and back-end refers to assembly, packaging and testing). The company is in the process of transitioning to a less capital-intensive manufacturing strategy and has recently announced a shutdown program to close some of its older facilities. Currently, ST's main wafer fabrication facilities are located in Agrate Brianza and Catania in Italy; Crolles, Rousset and Tours in France; Phoenix and Carrollton in the US; and Singapore. Highly efficient packaging and testing facilities in China, Malaysia, Malta, Morocco and Singapore provide strong back-end process security for these state-of-the-art fabs. Multinational Alliances ST has developed a global network of strategic alliances, including product development with major customers, technology development with customers and semiconductor vendors, and equipment and CAD tools with key suppliers. In addition, ST conducts various research programs with leading universities and prestigious research institutes around the world to promote industrial R&D activities through academic research. ST is also involved in European advanced technology research programs such as MEDEA+ and industrial programs such as ENIAC (European Nanotechnology Initiative Advisory Council). Principles of excellence ST was one of the first international semiconductor companies in the world to recognize the importance of environmental responsibility, starting its corporate environmental responsibility initiatives as early as the 1990s, and since then has made impressive progress on environmental issues, for example, reducing energy consumption per production unit by 47% and CO2 emissions by 61% between 1994 and 2006. In addition, ST is well ahead of existing regulations and has almost completely eliminated hazardous substances such as lead, cadmium and mercury from its manufacturing processes. Since 1991, the regional companies have been honored with more than 100 awards for excellence in corporate responsibility in the areas of quality, corporate governance, social issues and environmental protection. Basic Information Founded in 1987 as the result of the merger of SGS Semiconductor (Italy) and Thomson Semiconductor (France), ST has grown faster than the semiconductor industry as a whole from its inception to the present. Since 1999, ST has always been one of the world's top ten semiconductor companies. The entire group*** employs nearly 50,000 people, with 16 state-of-the-art R&D facilities, 39 design and arbitration centers, 15 major manufacturing facilities, and 78 sales offices in 36 countries. The company is headquartered in Geneva, Switzerland, which also serves as the headquarters for the European Region as well as Emerging Markets; the company's U.S. headquarters is located in Carrollton, Dallas, Texas; the Asia-Pacific Region is headquartered in Singapore; the Japanese operations are headquartered in Tokyo; and the Greater China Region is headquartered in Shanghai, with responsibility for the three regions of Hong Kong, Mainland China and Taiwan. Since completing its initial public offering on December 8, 1994, STMicroelectronics has been listed on the New York Stock Exchange (ticker symbol: STM) and the Euronext Paris Stock Exchange, and in June 1998, on the Milan Stock Exchange in Italy. STMicroelectronics has nearly 900 million publicly traded shares, of which approximately 71.1% are publicly traded on various stock exchanges. Another 27.5% of the shares are held by STMicroelectronics Holding II B.V. Limited, whose shareholders are the Italian Finmeanica consortium formed by Finmeanica and CDP, and the French consortium formed by Areva and France Telecom; the remaining 1.4% of treasury shares are held by STMicroelectronics Corporation. Product range ST has one of the broadest semiconductor product lines in the industry, with more than 3,000 major product types, from discrete diodes and transistors to complex system-on-chip (SoC) devices, to complete platform solutions including reference designs, packaged software, manufacturing tools and specifications. STMicroelectronics is a major supplier to a wide range of industries, with a broad portfolio of advanced technologies, intellectual property (IP) resources and world-class manufacturing processes. Semiconductor products can be broadly categorized into two groups: specialized products and standard products. Specialized products integrate a large amount of proprietary IP from semiconductor manufacturers as well as users and third parties, which differentiates them from other products in the market, such as: System-on-Chip (SoC) products Customized and semi-customized circuits Specialized standard products (ASSPs), such as: wireless processors, set-top box chips, and automotive ICs Microcontrollers Intelligent card ICs Specialized memories Specialized Discrete Devices (ASD?) Once a customer has used a specialized product in an application, it is usually not possible to replace the product without modifying the hardware and software design. Instead, a standard product is a device that implements a specific, commonly used function, and these devices are typically offered by several vendors. Often, standard products introduced by a manufacturer can be replaced by similar products from other manufacturers, with the differences between vendors being primarily in cost and customer service. However, once the design is frozen, the standard device also becomes the only device in terms of performance optimization. Standard products include: Discretes such as transistors, diodes, and thyristors Power transistors such as MOSFETs, Bipolar, and IGBTs Analog circuit building blocks such as operational amplifiers, comparators, voltage regulators, and voltage reference circuits Standard logic functions and interfaces Numerous memory products such as standard or serial NOR flash memory, NAND flash memory, EPROM/EEPROM, and non-volatile memory. EEPROM and non-volatile RAM RF discrete devices and ICs Since its inception, ST has successfully achieved a balanced approach to market development, combining differentiated, specialized products, which are often less susceptible to market cycles, with traditional standard products, which require less R&D investment and less capital-intensive production. ST's diversified product portfolio avoids overdependence on general-purpose or specialized products. Specialized products System-on-Chip The most complex of the specialized product families are SoC devices, which integrate a complete system on a single chip. In many cases, this means integration of the entire suite, i.e., the device integrates all electronic circuitry except for components that do not need to be integrated, such as memory, passive components and displays. However, often integrating the entire system on a single chip is not the most economical solution, so the term SoC is also used to refer to chips that integrate the majority of the system. SoC technology expands the semiconductor industry's ability to consistently increase the number of transistors on a given silicon wafer. However, it also involves many other factors, including system knowledge, software technology, architectural innovation, design, verification, debugging, and test methods. As semiconductor devices become more prevalent in electronic equipment and their significant impact on device performance, price, and development time, device manufacturers are becoming increasingly dependent on semiconductor suppliers for complete platform solutions. Today, semiconductor vendors can provide customers with complete solutions, including customized reference designs, complete software packages (containing underlying driver software, embedded operating systems, and middleware and packaged software). Many SoC products can be manufactured using only CMOS technology, but complete SoC manufacturing technology requires the ability to integrate basic technologies such as COMS, bipolar, non-volatile memory, power DMOS and micro-electromechanical systems (MEMS) into system-oriented technology (which integrates two or more basic technologies). ST has been a global leader in the development and adoption of these system-oriented technologies for many years. SoC devices typically incorporate one or more processor cores, and ST offers customers the world's broadest range of processor cores, including 32-bit high-performance ARM-based and PowerPC-based products, primarily for wireless and automotive applications. ST's open approach to processor core technology is designed to provide customers with the most appropriate processor core, whether proprietary, co-developed or licensed by a third party. Customized wafers Customized and semi-customized ICs are both designed for special users, but they are designed and manufactured differently. Semi-custom wafers are general-purpose wafers that contain a series of circuit units that can be interconnected in a variety of ways to achieve the desired functionality. Custom wafers, on the other hand, are designed from scratch. Some customers prefer to design their own wafers (especially those containing valuable IP) and contract manufacture them with a wafer manufacturer based on criteria such as cost, capacity allocation, and prior business relationships. Others prefer to agree with the wafer supplier on both design and manufacturing, so there is a series of intermediate relationships. ST offers a range of custom and semi-customized services that leverage world-class manufacturing machinery, unparalleled semiconductor process technology, a broad and deep IP portfolio and leading-edge design methodologies. These success stories are the use of complex wafers to drive large-scale projects such as the XM digital satellite radio service in the U.S. and leading-edge solutions for strategic partners in various parts of the electronics industry. Standard Products ASSPs (Application Specific Standard Products) are integrated circuits designed for use in special applications. Examples include digital set-top box chips, CMOS imaging ICs, motor control circuits and wireless application processors. Unlike custom ICs designed for single-user special applications, ASSPs are designed for special applications common to many users. Many ASSPs are developed in close cooperation with special customers, even though the corresponding devices may be available on the open market. By working with customers in this way, ST is able to ensure that the products and technologies it develops are well matched to the changing needs of industry. ST's product portfolio includes multiple types of ASSPs optimized for key growth business suites in wireless communications and networking, digital consumer, computer peripherals, automotive, industrial and smart cards. By offering chipsets with complete reference platforms, recognized software packages and development kits, the company enables its users to develop and differentiate their products quickly and cost-effectively. ST's ASSPs, ranging from mobile imaging to multimedia processing to power management and handheld and network connectivity suites, address a wide range of telecom suite requirements. The company offers components for a wide range of digital consumer applications, with a particular focus on set-top boxes, digital TVs and digital cameras. In the field of computer peripherals, ST focuses on power management and power supplies for data storage, printing, visual displays, and PC motherboards. A wide range of STMicroelectronics ASSP power/complex digital automotive systems, such as engine control, automotive safety equipment, door modules and in-vehicle infotainment systems. The company also offers industrial ICs for factory automation systems, chips for lighting and battery charging, or power supply devices and chips for advanced smart card suites. Microcontrollers ST's microcontrollers offer a wide range of packages, from those that require first and foremost the lowest cost to those that need strong real-time performance and high-level language support. ST's comprehensive product portfolio includes powerful 8-bit general-purpose flash memory microcontrollers with standard communication interfaces such as USB, CAN, LIN, UART, I2C and SPI, as well as dedicated 8-bit microcontrollers for brushless motor control, low-noise block converters (LNBs), smartcard readers, flash memory drivers with USB interfaces and programmable system memory (PSM). Memory (PSM), which integrates memory, microcontroller and programmable logic unit on a single chip; 16-bit industrial standard devices and flash memory controllers based on high-performance 32-bit ARM cores with excellent low-power characteristics and advanced communication peripherals (including Ethernet, USB and CAN). ST's specialized microcontroller solutions help accelerate the development of emerging low data rate wireless networks such as Real Time Location Systems (RTLS) and Zigbee platforms for remote monitoring and control. Security ICs STMicroelectronics offers a complete range of security microcontrollers and memories for smart card and tokenization applications, together with a broad portfolio of high-speed, co-locatable System-on-Chip (SoC) solutions. The products are used in all types of smart card applications, from the simplest phone cards to the most demanding SIM and Pay-TV cards. Security has always been an area of expertise for ST, as evidenced by several formal security certificates, standardized memberships, and the successful implementation of ST's secure IC products in many areas, including banking, IT security, electronic ***, public **** transportation and mobile communications. Memory While many memory products are standard products, ST has developed a wide range of specialized EEPROMs and flash memories, leveraging its strengths in non-volatile memory technology and its strong relationships with leading users. Working with leading OEMs, ST has developed innovative products optimized for specific applications such as cell phones, automotive engine controls, PC BIOS, set-top boxes and hard disk drives. Discrete devices ASD products are based on vertical or horizontal bipolar architectures implemented at the top and bottom of the wafer die. ASD technology enables ST to bring to the market a wide range of products that can handle large bi-directional currents, maintain high voltages and integrate a wide range of discrete components in a single die. ASD technology is an ideal solution for general purpose protection components, ESD protection devices, EMI filters and AC switches with built-in overvoltage protection. With recent process upgrades, ASD technology allows the integration of multiple discrete components and passive components (such as resistors, capacitors and inductors) in a single wafer, resulting in the IPAD family (Integrated Passive and Active Devices).The main areas of application for ASDs are wireless and fixed line communications, home appliances, PCs and peripherals. Standard products Memory ST offers the industry's broadest range of memory solutions for leading-edge applications. ST is a leading supplier of non-volatile memories, including NOR and NAND flash memories. Flash memories combine high density with electrical erasability. They are commonly used in a variety of digital applications such as cell phones, digital cameras, digital TVs, set-top boxes, automotive engine controls, etc., which require programmability in the system and need to retain data even in the absence of power. As one of the world's top three suppliers of NOR flash memory, ST offers two main types of flash memory: NOR and NAND. the NOR flash memory architecture provides fast read performance and is ideal for code storage and direct on-chip execution in cell phones and other electronics. However, for high-density data storage, the higher density and programming throughput of NAND flash memory makes it the preferred choice. ST's range of non-volatile memories also includes EPROMs (Erasable Programmable Read Only Memory), EEPROMs (Electrically Erasable Programmable Read Only Memory), Serial Flash Memory and non-volatile RAMs (Random Aess Memory). (Random Aess Memory). Other ST's memory products include a wide range of RFID ICs. as with all standard devices, cost and customer service are the main differences between suppliers, and ST is making every effort to optimize both. For applications that require both fast code reading and high density (such as today's multifunctional cell phones), ST also offers advanced multi-chip solutions that combine different types of memory in a single wafer package. Intelligent power supplies ST's power supply devices meet the growing demand for power solutions that integrate signal processing components (analog and/or digital) and electric actuators. This design capability not only offers exclusive economic advantages, but also provides improvements in stability, electromagnetic performance and reduction of airborne noise and weight. Intelligent power is a term of art that encompasses a wide range of horizontal and vertical technologies that play a critical role in the automotive market in particular. VIPower (Vertical Intelligent Power Supply) is the generic term for a number of patented intelligent power supply technologies in which discrete power structures are now combined with analog and digital control and diagnostic currents, allowing devices to combine the power of discrete technology with the control and diagnostic capabilities of the current. ST's BCD (Bipolar-CMOS-DMOS) production technology combines bipolar, CMOS and DMOS processes, allowing the integration of an increasing number of system fundamentals such as voltage regulators, communication interfaces and multi-load drivers in a single component. Standard devices ST's standard linear devices and logic ICs consist of a wide range of well-known standard devices and specialized devices for highly integrated, space-constrained sets of innovations. The product range includes logic functions, interfaces, operational amplifiers, comparators, low-power audio amplifiers, communication circuits (high-speed analog, infrared and RF), power management devices, voltage regulators and reference circuits, microprocessor resets and monitors, analog and digital switches, power switches, VFD drivers, and high-brightness LED drivers. Discrete Devices ST is one of the world's leading suppliers of discrete power devices, including MOSFETs (including those utilizing the innovative MDmeshTM second generation technology), bipolar transistors, IGBTs, Schottky and ultra-fast-recovery bipolar process diodes, three-terminal bi-directional controllable silicon switches and protection devices. In addition, ST's patented IPAD (Integrated Passive and Active Devices) technology allows the integration of multiple active and passive components in a single chip RF ST's RF products include power RF transistors that can be used in applications such as ISM (Industrial Scientific and Medical) and cellular base stations. Real-Time Clocks ST offers a complete line of low-power real-time clocks (RTCs), from input-level products to high-end RTCs with microprocessor monitoring, SRAM, non-volatile features, and general-purpose reduced-detection pipelining for advanced data protection. embedded software calibrated to an accuracy of only 2 seconds per month. ST Alliances Strategic Alliances and Industry Collaborations Since its birth, ST has been a pioneer in creating strategic alliances and is recognized for developing relationships with users, suppliers, competitors, universities, research institutes and European research programs. Strategic alliances and industry cooperation are becoming increasingly important for success in the semiconductor industry. STMicroelectronics has formed strategic alliances with users including Alcatel, Bosch, Hewlett-Packard, Marelli, Nokia, Nortel, Pioneer, Seagate, Siemens VDO, Thomson and Western Digital. Several strategic alliances have been formed with customers such as Marelli, Nortel, Pioneer, Seagate, Siemens, VDO, Thomson and Western Digital. The user alliances provide ST with valuable systems and application expertise and access to major product markets, while enabling its users to share the risk of product development and also to have access to ST's process technology and production facilities. STMicroelectronics is now actively utilizing its extensive experience and technology to expand the number of its user alliances with top OEMs in the United States, Europe and Asia. While continuing to compete for sales, partnering with other manufacturers in the semiconductor industry allows ST to increase its investment in costly research and development and manufacturing resources, thereby realizing the mutual benefits of technology development. STMicroelectronics has been a consistent winner in the field of wireless technology, collaborating with Texas Instruments in 2002 to develop and promote an open standard for the wireless suite of processor interfaces. This innovation has now spread to more companies and is known as the MIPI Consortium (founding members are ST, ARM, Nokia and Texas Instruments). The consortium now has over 92 members, collaborating to become leaders in the mobile industry, with the goal of developing and promoting open standards for the mobile suite of processor interfaces. Non-volatile memory is a strategic product division of STMicroelectronics. In this area, ST has been working with Hynix for four years on the joint development of NAND Flash technology and products. As for NOR Flash, it has formed a strategic alliance with Intel on product targets for wireless sets. And, it recently signed an agreement with Freescale to jointly develop microcontrollers with embedded Flash (manufactured using 90nm technology). ST has also established joint development programs with leading suppliers such as Air Liquide, Applied Materials, ASM Lithography, Axalto, Canon, Hewlett-Packard, KLA-Tencor, LAM Research, MEMC, Teradyne and Wacker, as well as leading electronic design automation (EDA) tool manufacturers including Cadence, CoWare and Synopsys. In terms of joint R&D programs, ST also participates in European collaborative research programs such as MEDEA+ (a pan-European program for advanced collaborative R&D in the field of microelectronics and its applications) and ITEA2 (a strategic pan-European program for advanced pre-competitive R&D in Europe for the development of information technology, software-intensive systems and services). ST also plays a leading role in the recently created European technology platforms - ENIAC (European Nanoelectronics Initiative Advisory Committee, which provides strategic research directions in nanoelectronics) and ARTEMIS (Advanced Research and Technology for Embedded Intelligence and Systems, which plays a similar role to that of embedded systems). Furthermore, ST also cooperates with numerous universities worldwide, including those in Europe, the United States and China, as well as with major research institutes such as CEA-Leti and IMEC. With regard to manufacturing, in 1998 ST opened its back-end assembly and test facility in Shenzhen, China. The plant was in the nature of a joint venture between ST and Shenzhen Haidake Industrial Company Limited (SHIC) **** In 2004, ST signed and published a joint venture agreement with Hynix to establish a front-end memory manufacturing facility in Wuxi, China. The joint venture is an extension of the inter-company NAND Flash process/product co-development relationship, with a 200-mm wafer production line to be put into production by the end of 2006 and a 300-mm wafer production line to be put into production in 2007. ST University University Profile Using management and field training needs as a benchmark, ST University develops and deploys strategic, enterprise-wide training programs.ST University works closely with ST's various training organizations to introduce training program curricula that are designed to meet the evolving training needs of ST and ST University. There is only one training program in the ST University training catalog that is geared towards both ST employees and external engineers. The main objective of this technical program is to develop technical expertise in the field of microelectronics manufacturing management. This unique program was developed by STMicroelectronics and 2 leading French engineering schools - "L'Ecole Nationale Supérieure des Mines" de Saint-Etienne and "l'Ecole Centrale" Marche. 'Ecole Centrale' Marseille. It provides technical and managerial skills to engineers who play a key role in today's demanding microelectronics industry. In order to keep pace with the leading technologies in the microelectronics industry, ST University improves the entire program every year with the support of industry experts, academics and researchers.ST University develops and improves the relationship between the theoretical curriculum and the suite of applications, as well as the participation of ST industry experts and ST suppliers. Curriculum The program is divided into 2 main parts: Part 1: Focuses on fundamentals and nested courses in the following 3 areas: Devices and technologies: physical characterization tools and manufacturing process steps. Development of integrated circuits: design tools, testing and back-end operations. Production and management tools: production equipment management, production techniques, reliability and quality systems. Part 2: 6-month internship in a company (mainly in ST) focusing on specific subjects related to the project. China Joint STMicroelectronics (ST) and China First Automobile Company Limited (FAW, FAW) have announced their cooperation in the field of automotive electronics technology and the establishment of the FAW-STMicroelectronics Joint Laboratory for Automotive Electronics at the FAW Technology Center. The joint lab will be oriented towards advanced automotive electronics technology solutions, with R&D covering powertrain, chassis, safety systems, bodywork, automotive infotainment systems, and new energy technologies. FAW will introduce ST's microcontrollers (MCUs), application-specific standard products (ASSPs) and intelligent driver chips within its advanced automotive electronics R&D platform. The main R&D direction of the joint lab is advanced automotive electronics suite. Leveraging ST's automotive electronics R&D experience, technology strengths, products (e.g., ST's PowerPC family of 32-bit microcontrollers and highly integrated chips for engine management systems), prototyping, and technical support, the joint lab will promote collaborative R&D in automotive electronics technologies, such as ECUs (Engine Control Units), TCUs (Transmission Control Units) and EPSs (Electric Power Steering Systems). (electric power steering system), which will enhance the market competitiveness of FAW's next-generation vehicles. Li Jun, Deputy Chief Engineer and Director of Technology Center of FAW Group, said: "China has been the world's top automobile sales volume for three consecutive years, and as consumers are increasingly concerned about automobile safety and comfort, the automotive electronics market is growing at a rapid pace, and China is a huge automotive semiconductor market. The establishment of a joint laboratory between FAW and STMicroelectronics will help promote in-depth cooperation between the two parties, enhance the core competitiveness of FAW's automotive electronics, and promote the independent innovation capability of automotive electronic products." Edoardo Merli, Marketing & Suites Manager, Automotive Products Division, Greater China & South Asia, STMicroelectronics, said, "We are very pleased to be able to work with FAW, one of China's leading automotive OEMs. As the No. 1[1] automotive chip supplier in China and No. 3[2] worldwide in 2011, STMicroelectronics has great strengths in powertrain, body, safety, infotainment and in-vehicle multimedia, and such strengths are recognized by Chinese automakers. We believe that the partnership will also strengthen ST's leading position in China's automotive electronics industry."