What is the use of cmp diagram?

Cmp drawing can provide abstract image display for mechanical manufacturing and assembly, and can let engineers see the internal structure of machinery more intuitively.

Chemical mechanical polishing (CMP) is a key process to realize wafer surface planarization in integrated circuit manufacturing. Different from the traditional pure mechanical or chemical polishing method, CMP process can remove different micro/nano materials on the wafer surface by combining surface chemical action with mechanical polishing technology, so as to realize nano-level planarization of the wafer surface and enable the next lithography process to be carried out.

The main working principle of CMP is that the polished wafer moves relative to the polishing pad under a certain pressure in the presence of polishing liquid. With the help of the highly organic combination of the mechanical grinding action of nano-abrasive and the chemical action of various chemical reagents, the polished wafer surface can meet the requirements of high flatness, low surface roughness and low defects.