Excuse me, what does plastic molding do in post-semiconductor process?

1. The "molding" in the post-semiconductor process is: injection molding, that is, a piece of lead frame that has been welded by DIie bond and wire welding is plastic-sealed.

2. The property of mutual friction between macromolecules when molten plastic flows is called the viscosity of plastic, and the coefficient of this viscosity is called viscosity, so viscosity is a reflection of the fluidity of molten plastic. The greater the viscosity, the stronger the viscosity of the melt, and the worse the fluidity, the more difficult it is to process.

3. It is impossible for all products to be processed under sealed door conditions. For specific products, it is necessary to carry out gate sealing test, and test the products with gate sealing and those without gate sealing to determine which way is the best. This may cause 100% of the test samples to have poor performance when the gate is frozen, and 100% of the products with unfrozen gates pass the test, and vice versa. It is impossible to tell what is going on just by observing the sample or process. The answer can only be found by conducting gate seal test and testing samples.

4. If the gate is not sealed, which is beneficial to the performance of the product, then the time required for cooling the gate is half. Due to normal temperature and process changes, the worst case is to choose an accurate gate sealing time. However, sometimes it is necessary to seal the gate when producing products, and sometimes it will produce inconsistent products in turn.