The difference between sub and pcb technology

PCB printed (brushed) circuit board, including substrate and printed conductive patterns (wires, pads, vias, etc.). ) covering the substrate; Substrate-substrate. Most of them are hard or soft insulation boards, which are used to carry printed conductive patterns.

PrintedCircuitBoard, abbreviated as PCB, CircuitBoard, is the support of electronic components and the carrier of electrical connection of electronic components. It is one of the most common electronic components, and the 1- 12 layer is widely used in the market.

A package substrate is a substrate (sub for short), also known as an IC carrier. IC package substrate is directly used to carry the chip, providing support, protection and heat dissipation for the chip, and providing electronic connection between the chip and PCB motherboard.

The characteristics of IC package substrate include hole-filling electroplating and hole overlap, high-density lamination, various surface treatment methods, thin plate and surface flatness requirements, high pin count and short electrical interconnection distance, high-density imposition, array lead-free solder ball bumps and copper column bumps, lamination technology and hole overlap structure, and fine circuit technology.