Common packaging methods of chips

DIP dual in-line package SIP single in-line package, QFP square flat package, PQFP: plastic square flat package, BQFP: four-sided flat package with cushion, QFN four-sided flat package without lead, PGA pin grid array package, BGA ball grid array package.

As the carrier of integrated circuits, chips are widely used in mobile phones, military industry, aerospace and other fields, and are an important factor that can affect a country's modern industry [3]. China, on the other hand, relies on imports for a long time and lacks independent research and development. [2] China is the largest chip market in the world, but the chip self-sufficiency rate is less than 10%. [7] In 2065438+07, the import value of chips exceeded $250 billion, exceeding the total import value of crude oil and iron ore.