What packaging technologies are used in c4?

Tin ball, controlled plastic, lead-free welding, piezoelectric connection.

In the field of electronic equipment manufacturing, C4 is a common packaging technology, which is used to connect chips with substrates or other chips. C4 packaging technology includes the following forms:

1, solder ball is one of the most common C4 packaging technologies. It uses metal alloy balls as the connecting medium to connect the pins on the chip with the corresponding pins on the substrate or other chips. The solder balls are fixed on the chip pins by hot pressing welding or furnace temperature reflow welding.

2.CDPA technology uses special plastic adhesive instead of traditional solder ball connection. This adhesive has controllable deformation performance and can form a firm connection after heating and pressurizing.

3. Due to environmental requirements, many electronic equipment manufacturers have turned to lead-free welding technology. Lead-free welding uses lead-free alloy as solder to replace traditional lead-tin alloy. This technology is also widely used in C4 packaging.

4. Piezoelectric connection is a technology that uses piezoelectric effect to realize the connection between chip and substrate. By applying an electric field, the piezoelectric material is deformed, thereby establishing or interrupting the connection between the chip pins and the substrate.