What is the detailed process of FPC production?

FPC production process (whole process)

1.FPC production process: 1. 1 double-panel process:

Cutting → Drilling → PTH → Electroplating → Pretreatment → Sticking Dry Film → Alignment → Exposure → Development → Graphic Electroplating → Stripping → Pretreatment → Sticking Dry Film → Alignment Exposure → Development → Etching → Stripping → Surface Treatment → Sticking Film → Pressing → Curing → Nickel and Gold Plating → Printing Characters → Cutting → Electrical Testing → Punching → Final Inspection →

1.2 veneer technology:

Cutting → Drilling → Sticking Dry Film → Alignment → Exposure → Development → Etching → Stripping → Surface Treatment → Sticking Film → Pressing → Curing → Surface Treatment → Nickel and Gold Plating → Printing → Cutting → Electrical Measurement → Punching → Final Inspection → Packaging → Delivery.

Cutting material

2. 1. Know the raw material code.

NDIR0505 13HJY: D→ double-sided, R→ calendered copper, 05→PI thickness of 0.5mil, i.e. 12.5um, 05→ copper thickness 18um, 13→ adhesive layer thickness/kloc-.

XSIE 10 1020TLC: S→ single side, E→ electrolytic copper, 10→PI thickness 25um, 10→ copper thickness 35um, 20→ glue thickness 20um.

CI05 12NL: (film covering): 05→PI thickness 12.5um, 12→ glue thickness12.5um. Total thickness: 25um. 2.2. Process quality control.

A. Operators should wear gloves and finger covers to prevent the surface of copper foil from being oxidized by sweat on their hands. B correct material laying method to prevent wrinkling.

C. Offset is not allowed, and manual alignment shall not damage the punch positioning hole and test hole.

D material quality: the surface of the material is free from wrinkles, stains, reoxidation, burrs, glue overflow, etc. Step 3 drill holes.

3. 1 packaging: select cover plate → assemble plate → tape → make arrow (mark).

3. 1. 1 Packaging requirements: 30 sheets of single board, 6 sheets of double board, and packaging 15 sheets. 3. 1.2 Main functions of cover plate:

A: Prevent the drilling rig and presser foot from squeezing the material surface. B: Make the drill tip center easy to locate and avoid the deviation of drilling position.

C: Take away the heat generated by the friction between the drill bit and the hole wall. Reduce the twist of the drill bit. 3.2 Drilling:

3.2. 1 process: startup → upper plate → transfer to program → setting parameters → drilling → self-inspection →IPQA inspection → mass production → next process.

3.2.2. Control methods of drilling needles: a. Control of use times; b. Identification and inspection methods of new drills.

3.3. Quality control points: A. Correctness of drilling adhesive tape B. For red film, confirm whether the position and number of holes are correct. C. confirm whether the holes are completely connected. D the appearance shall be free of copper warpage, burr and other undesirable phenomena. 3.4. Common undesirable phenomena.

3.4. 1 Broken needle: A. Improper operation of drilling rig B. Problems with drill bit C. Too fast feed, etc. 3.4.2 Burr A. Incorrect cover plate and backing plate B. Electrostatic adsorption, etc. 4. Electroplating.

4. Principle and function of1.PTH: PTH is a process of depositing copper ions on the activated hole wall and copper foil surface by autocatalytic redox reaction of plating solution (palladium and copper atoms as catalysts) without external current, also called chemistry.

Copper plating or autocatalytic copper plating.

4.2.PHT process: alkali degreasing → water washing → micro-etching → water washing → prepreg → activation → water washing → water washing → acceleration → water washing → copper melting → water washing.

4.3. Treatment of common adverse reactions of parathyroid hormone

4.3. 1. There is no copper in the hole: activated palladium is not well adsorbed and deposited; B accelerator tank: the accelerator concentration is wrong; C chemical copper: the temperature is too low, so the reaction speed is too slow; The bath composition is wrong.

4.3.2. There are particles and roughness on the hole wall: A there are particles in the chemical bath, and the copper powder is unevenly deposited. Open the filter to filter. B. The hole wall of the plate itself has burrs.

4.3.3. Surface blackening: the composition of chemical tank A is wrong (NaOH concentration is too high).

4.4 Copper plating refers to improving the uniformity of the coating in the hole and ensuring that the coating thickness of the whole layout (the whole coating in the hole and near the orifice) meets certain requirements 4.4. 1 electroplating condition control A current density selection B electroplating area size C coating thickness requirements D electroplating time control 4.4. 1 quality control.

1 penetration: self-inspection, QC full inspection, check whether there is copper plating on the hole wall with a 40-fold magnifying glass. 2 Surface quality: The surface of copper foil should be free of scorch, peeling, graininess, pinholes and bad spots. 3. Sticking: After being stuck at any position on the edge of the plate with 3M adhesive tape, it should be connected vertically upwards. 5. The thread should not fall off.

5. 1 Dry film is attached to the board, and the circuit is basically formed after exposure and development. In this process, the dry film mainly plays the role of image transfer and protects the circuit during etching.

5.2 Dry film is mainly composed of PE, photoresist and PET. Among them, PE and PET only play the role of protection and isolation. Photoresist includes: linker, initiator, monomer, adhesion promoter and pigment.

5.3 Operation requires A to keep dry film and board clean, and B to be smooth, free of bubbles and wrinkles ... to meet the requirements of high adhesion.

5.4 Key points of operation quality control

5.4. 1 In order to prevent wire breakage during pasting, impurities on the surface of copper foil should be removed with a dust-free paper roller. 5.4.2 Parameters such as temperature, pressure and revolution of heating roller should be set according to different plates. 5.4.3 Ensure that the directions of copper foil holes are consistent. 5.4.4 Prevent oxidation and direct contact with the surface of copper foil.

5.4.5 There should be no scars on the heating roller to prevent wrinkling and poor adhesion.

5.4.6 Let it stand for 10-20 minutes after sticking the film, and then expose it. The time is too short, the organic polymerization reaction is incomplete, and the time is too long to hydrolyze easily, resulting in poor coating. 5.4.7 Always wipe off impurities and spills on the heating roller with dust-free paper. 5.4.8 Ensure that the film has good adhesion. 5.5 Confirm the quality of dry film.

5.5. 1 Adhesion: The circuit shall not be bent, deformed or broken (detected by magnifying glass) after exposure and development after sticking the film. 5.5.2 Flatness: it shall be flat and free from wrinkles and bubbles. 5.5.3 Cleanliness: No more than 5 impurities per sheet. 5.6 exposure.

5.6. 1. Principle: The lines are transferred to the board through the action of dry film. 5.6.2 Key points of operation: a Keep the membrane and plate clean during operation.

The negative should be properly aligned with the cardboard. There should be no bubbles and impurities.

* The purpose of vacuumizing is to improve the contact tightness between negative film and dry film and reduce astigmatism. * Exposure energy also affects quality;

1 Low energy and insufficient exposure. After imaging, the resist is too soft and the color is dark. During the etching process, the resist is damaged or floated, resulting in an open circuit.

2. High energy will lead to overexposure, circuit shrinkage or exposure area will be washed away easily. 5.7 development.

5.7. 1 Principle: Imaging is to treat the exposed plate with dry film with (1.0+/-0. 1)% sodium carbonate solution (developer), wash off the unexposed dry film, and keep the exposed dry film, so that lines are basically formed.

5.7.3 Process parameter control: solution solubility, developing temperature, developing speed and spraying pressure. 5.7.4 Key points of quality control:

A, there can be no water droplets on the wrench, and it should be blown clean. B, dry film protective film should not be torn.

C, the imaging should be complete, and the lines should not be serrated, bent or thinned.

D, bare copper surface after development should be lightly scraped with a knife, otherwise the quality will be affected at any time. E. The error between dry film linewidth and negative film linewidth should be controlled within 0.05 mm. 。

F, the complicated side of the circuit is placed downward to avoid film residue and reduce uneven development caused by pool effect.

G, according to the solubility of sodium carbonate, origin and use time, update the shadow solution in time to ensure the best development effect.

H, regularly clean the scale in the tank, nozzle and nozzle to prevent impurities from polluting the plate and causing uneven distribution of developer. First, in order to prevent the plate from being stuck in operation, the rotating device should be stopped immediately when the plate is stuck, and the plate should be taken out and sent to the middle of the developing table. If it is not fully developed, it should be redeveloped.

J, the plates after development and drying should be separated by green film to prevent dry film adhesion from affecting the quality at all times. 5.8 Etching and Stripping.

5.8. 1 Principle: Etching is to spray etching solution evenly on the surface of copper foil through a nozzle at a certain temperature (45-50℃), and react with copper without the protection of etching inhibitor, but unnecessary copper reacts, and the exposed substrate is peeled off to form a circuit.

5.8.2 Main components of etching solution: acidic etchant (copper chloride), hydrogen peroxide, hydrochloric acid and soft water 5.9 Key points of etching quality control:

5. 9. 1 No copper residue, wrinkles, scratches, etc. 5.9.2 The pipeline shall be free from deformation and water drops.

5.9.3 The speed should be appropriate at all times, and line thinning and incomplete etching caused by excessive etching are not allowed. 5.9.4 The dry film on the line solder joint should not be washed away or damaged.

5.9.5 Unhealthy quality such as oil stain, impurities and warping of copper skin is not allowed at any time after peeling. 5.9.6 When placing plates, pay attention to avoid board jamming and prevent oxidation.

5.9.7 The uniform distribution of liquid medicine shall be ensured at any time, so as to avoid uneven etching on the front and back or different parts on the same side. Process control parameters:

Etching solution temperature: 45 5℃, stripping solution temperature: 55 5℃, etching temperature: 45-50℃, drying temperature: 75 5℃, front and rear plate spacing: 5- 10 cm 6, and pressing.

6. 1 surface treatment: surface treatment is an auxiliary process used many times in the process. As the pretreatment or post-treatment process of other processes, the plate is generally treated with acid and oxidation resistance first, and then the surface of the plate is polished and removed with a grinding brush.

Impurities, blackening layer, residual glue, etc. On the board.

6. 1. 1 process flow: feeding-pickling-washing-grinding-pressurized washing-drying-discharging 6. 1.2 grinding:

A, pasting and packaging: polishing, removing red spots (NaOH remained after film peeling) and deoxidizing. B. Stick and reinforce: polish it clean. 6. 1.3 surface quality:

A. All the places that need polishing have traces of uniform polishing brushes.

B) The surface shall be completely dry, and there shall be no oxidation or water drop residue. C) There should be no rollers that cause wrinkles and squeezing. 6. 1.4 Common defects and prevention:

There are traces of water droplets on the surface. At this time, check whether the sponge roller is too wet, and regularly clean and squeeze water. B completely remove the oxidized water, and check whether the brush roller pressure is enough and the transfer speed is too fast. The blackening layer was not cleanly removed. 6.2 Fit:

6.2. 1 Operating procedures:

A prepare tools, determine the number of semi-finished products to be pasted, and prepare the correct packaging.

Copper foil must not be oxidized. Check and clean the copper foil: brush the surface lightly with a brush to remove fluff or impurities. Tear off the sealed release paper.

D. Align the package correctly according to the flow card and MI data and fix it with an electric iron. E the bonded semi-finished products should be sent to press as soon as possible to avoid oxidation. 6.2.2 Key points of quality control:

Check whether the exposure and drilling position of packaging/reinforcement are completely correct according to the process card and MI data. B. The precise deviation of alignment shall not exceed the regulations of flow cards and MI data.

C there should be no oxidation on the copper foil, no burr on the edge of encapsulation/reinforcement, and no impurity residue inside. D work tools should not be placed on the wrench, otherwise it may cause scratches or crush injuries.

6.3 Pressing: Pressing includes several steps such as traditional pressing, rapid pressing and oven curing. The purpose of hot pressing is to make the covering film or reinforcing plate completely adhere to the wrench, and achieve good adhesion by controlling the temperature, pressure, pressing time and stacking combination mode of auxiliary materials, so as to minimize the defects such as rolling, air bubbles, wrinkling, glue overflow and wire breakage in operation.

6.3. 1 Auxiliary materials for rapid compaction and its functional glass fiber cloth: isolation and release

B Niflon: Dust-proof and Pressure-proof C-fired iron plate: heating and gas production 6.3.2 Common bad phenomena

A bubble: (1) auxiliary materials such as silica gel membrane are not available; (2) The steel plate is uneven; (3) The protective film expired and B was crushed; (1) Accessories are not clean.

C displacement of reinforcing plate: (1) instantaneous pressure is too large (2) steel bar is too thick (3) steel bar is not firmly attached. 6.3.3 Quality confirmation

A must be flat after pressing, and there can be no wrinkles, crushing, bubbles, curling, etc. Line B should not be pulled off due to the influence of pressing.

C the package or reinforcing plate must be completely sealed and cannot be peeled off by hand. 7 screen printing.

7. 1 basic principle: polyester or stainless steel mesh cloth is used as the carrier, and the patterns of positive and negative films are transferred to the mesh cloth by direct latex or indirect plate making to form a screen plate, which is used as a tool for face printing to print the required patterns and characters on the plate.

7.2 Classification and function of printing ink Solder-proof ink-Insulation and protection of circuit characters-Silver paste for marking lines-Anti-electromagnetic interference 7.3 Quality confirmation

7.3. 1. The front and back of the printing position and direction must be consistent with the physical objects on the work instruction and inspection standard card. 7.3.2. There should be no fixed disconnection or pinhole.

7.3.3 ... After baking and curing, try it with 3M adhesive tape, and no ink will fall off. 8 punch holes.

8. 1 Common defects: offset, rolling, reverse, burr, copper warping, scratches, etc. 8.2 Key points of process control: correctness, directionality and dimensional accuracy of fixture. 8.3 Key points of operation:

8.3. 1 The product surface shall be free of scratches, wrinkles, etc. 8.3.2 The offset shall not exceed the specified range. 8.3.3 Correct use of molds with the same material number.

8.3.4 There should be no serious burr, pulling, tearing or abnormal concave-convex points or residual glue and reinforcement deviation, and the release paper should fall off. 8.3.5 Work safely and observe the safety operation manual ... 8.4 Common defects and their causes:

8.4. 1. Punching deviation A: human reason B: surface treatment, etching, drilling and other processes. 8.4.2. Crushing injury A: molding injury B: compound die 8.4.3. Copper warpage A: slow speed, low pressure B: blunt blade 8.4.4. Punching deviation a.