Comparison between traditional aluminum interconnect and advanced copper interconnect?

As a relatively mature technology, aluminum wiring technology has been widely used in VLSI because of its stable technology, relatively low cost performance and mature technology. With the continuous improvement of chip integration requirements, copper technology has brought great changes to the interconnection materials of silicon wafers. In the high-end applications of logic chips (130 nm and below), it has obvious advantages because of its low resistance (30% lower). However, for DRAM and FLASH, which are more concerned about the manufacturing cost, even at 1 10 nm and below, the continuously developed and updated aluminum process is still very competitive. Overview of aluminum-filled wiring technology aluminum wiring can be used as a connection gap of flat wiring, or directly as a filling material to replace the traditional tungsten plug. For the former, an aluminum film is deposited on the entire surface of the wafer, and a wiring pattern is formed after metal etching. The process is relatively simple, and the process steps are reduced, thereby reducing the cost.